Item available for sale
Make: ASM X
Model: Feeders
Reference No.: 492L
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Make: Omron
Model: VT S500-02
Reference No.: 491L
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Make: Juki
Model: RS-1
Reference No.: 490L
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Make: Nordson
Model: ASSURE
DOM: 2021
Reference No.: 489L
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Make:Technical Devices
Model: Etherm E-400
Reference No.: 488L
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Make: Universal
Model: Advantis 3
Reference No.: 487L
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Make: PVA
Model: PVA 3000
Reference No.: 486L
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Make:Vitronics & SouthTek Systems
Model: Soltec ZEVAm
DOM: 2021
Reference No.: 486L
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The 2021 Vitronics Soltec ZEVAm is a high-performance inline selective soldering machine designed for precision and efficiency in PCB assembly. Engineered for mixed-technology boards, the ZEVAm ensures accurate soldering of through-hole components without compromising nearby surface-mount devices.
Precision Soldering – The ZEVAm utilizes high-accuracy robotic nozzle movement for selective soldering, ensuring consistent and defect-free joints.
Triple Solder Pots – With three independent solder pots, the machine supports different alloy types and flux chemistries, allowing for lead-free and leaded soldering in the same system.
N₂ Generator Integration – The built-in nitrogen system creates an oxygen-reduced environment, preventing oxidation, improving solder flow, and reducing dross.
Automated Fluxing and Preheating – The system applies flux with precision, followed by programmable preheating zones that stabilize PCB temperatures and activate flux before soldering.
Inline Conveyor System – The fully automated conveyor enables smooth inline integration with existing production lines, optimizing throughput.
Advanced Process Control – Equipped with real-time monitoring and process control software, the ZEVAm ensures consistent quality and traceability.
High-Speed Inline Operation – Designed for continuous production lines, improving efficiency.
Reduced Defects and Rework – Optimized heat distribution and nitrogen shielding enhance solder joint reliability.
Cost Efficiency – Minimizes solder and flux waste while reducing nitrogen supply costs through its built-in generator.
The Vitronics Soltec ZEVAm is a versatile and reliable solution for manufacturers seeking high-quality selective soldering with enhanced process control and automation.
Make: MPM EDISON 300
Model: EDISON 300
DOM: 2017
Reference No.: 485L
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NOTE: The unit being offered for sale MAY or MAY NOT have one or all of the features or options as described here. Please contact SMT SALES GROUP for more information about the listed tool.
The Edison printer is the industries’ most accurate printer (certified by third party) with +/- 15μ @ 6σ wet print repeatability. Total throughput is lightning fast due in part to the highly-efficient, parallel processing of the stencil shuttle system, stencil wiping, paste dispensing and vision alignment system. The MPM Edison™ stencil printer is ideally suited for the growing Automotive, Semiconductor and Smart Device manufacturing markets.
Edison’s parallel processing system is extremely fast resulting in a very short cycle time. This helps increase throughput by shortening total time per PCB printed. This leaves more time for key overhead functions that have the biggest impact on print quality:
Best-in-class printing with a 25% improvement in wet print accuracy over current printers: Built-in +/- 8 micron alignment, and +/- 15 micron wet print repeatability (≥2 Cpk @ 6σ) proven through 3rd party Print Capability Analysis (PCA) testing.
BTB is a flexible dual lane solution without adding line length; identical single-lane printers are easily re-deployed to other lines when needed. Use in BTB configuration, or singly as a stand-alone.
MPM Intueri is a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with OpenApps for maximum capability and connectivity and provides a portal to Industry 4.0 concepts.
Single axis closed-loop pressure control for dual squeegee eliminates front-to-back variation; a single high precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintaining the set pressure across the entire board surface.
Ability to have three boards in the machine simultaneously, reduced distance on input conveyor by pre-loading the board during the print process results in reduced transfer times and improved cycle time.
The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.
Edison features a high-speed vision alignment system with an ultra-thin camera. The overall gantry thickness is only 39 mm featuring an ‘on the fly’ ‘POE’ (Power Over Ethernet) camera. A single CCD split field provides precision simultaneous up-down image acquisition with a field of view 9.0 x 6.0 mm.
MPM Intueri is a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with Open Apps for maximum capability and connectivity and provides a portal to Industry 4.0 concepts.
OpenApps™ is an open application interface with a development kit that allows customers to develop custom interfaces in support of Industry 4.0 initiatives. Using OpenApps we can provide support for factory automation standards such as Hermes and Pulse and communication with Manufacturing Execution Systems (MES). MPM printers support industry standards like CamX, SECS/GEM and SMEMA.
The Edison SECS/GEM package provides a ready-made interface that enables MES integration for product verification, traceability, and other MES functionalities. SECS/GEM is a semiconductor industry communication standard that provides a common interface for MES connectivity.
The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.
The PrinTrack feature adds traceability, data harvesting, and reporting to your printing process. With PrinTrack, you always have an easy access to a comprehensive history, detailing:
A flexible web reporting interface can be user-configured to produce traceability reports.
The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration ‘on the fly’ to stay on target and prevent print defects.
A super-size 65m paper roll allows 10,000 prints per change. Patented paper tension control provides more effective wiping and a separate wiping and printing zone prevents cross contamination.
Make: Fuji
Model: NXTIIC M6
DOM: 2014
Reference No.: 484L
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