YesTech YTX-3000 Manual X-Ray System
Manufacturer: YesTech
Model # YTX-3000
DOM: 2009
Reference No.: 528L
Information:
YESTECH YTX-3000 Manual X-Ray Inspection System
High-Resolution PCB, BGA, SMT Solder Joint & Electronic Assembly X-Ray Inspection
SMT Sales Group is pleased to offer this 2009 YESTech YTX-3000 X-Ray Inspection System, a proven solution for non-destructive inspection of printed circuit boards, BGAs, CSPs, QFNs, leadless devices, solder joints, hidden interconnects, and electronic assemblies.
The YTX-3000 was designed specifically for electronics manufacturing environments requiring affordable, high-quality X-ray inspection without the complexity and expense of fully automated inline systems. This system is ideal for EMS providers, contract manufacturers, OEM electronics facilities, failure analysis labs, prototype departments, engineering groups, aerospace, military, medical, automotive, and high-reliability electronics production.
This particular system was manufactured in October 2009 and includes the original YES X-Ray Software Version 2.2, operator documentation, and equipped with a Hamamatsu X-ray imaging assembly.
Key Applications
- BGA Inspection
- CSP Inspection
- QFN Inspection
- Leadless Device Inspection
- SMT Solder Joint Analysis
- Through-Hole Solder Inspection
- Voiding Analysis
- Solder Bridging Detection
- Open Joint Detection
- Head-in-Pillow Detection
- Hidden Interconnect Inspection
- PCB Failure Analysis
- First Article Inspection
- Process Verification
- Rework Verification
- Electronics R&D Inspection
System Features
High Resolution X-Ray Imaging
The YTX-3000 utilizes a precision X-ray imaging platform allowing operators to inspect hidden solder joints and internal package structures that cannot be evaluated using traditional optical inspection methods.
Software Package Included
- YES X-Ray Software Version 2.2
- User Manual Included
- Image Capture Functions
- Inspection Tools
- Measurement Utilities
- Defect Documentation Capability
Typical Defects Identified
BGA Defects
- Insufficient solder
- Excess solder
- Missing balls
- Bridging
- Voids
- Cracked joints
- Cold solder joints
QFN Defects
- Center pad voiding
- Wetting issues
- Opens
- Shorts
SMT Process Issues
- Head-in-pillow
- Lifted leads
- Solder starvation
- Excess solder
- Internal package defects
| Specification | Approximate Value |
|---|---|
| Model | YTX-3000 |
| Manufacturer | YESTech |
| Year | 2009 |
| Inspection Type | Manual X-Ray |
| Application | Electronics Assembly Inspection |
| X-Ray Source | Microfocus X-Ray |
| Detector | Hamamatsu Digital Imaging System |
| Motion System | Motorized XY Positioning |
| Software | YES X-Ray Software v2.2 |
| Power | 120 VAC |
| Power Consumption | 1500 Watts Maximum |
| Operating Mode | Off-Line Inspection |
| Safety Enclosure | Fully Shielded Cabinet |
SMT Sales Group Standard Terms
Condition
Unit was removed from a production environment.
System includes the original software and documentation shown in photos.
Normal cosmetic wear from previous industrial use may be present including scratches, scuffs, labels, and minor cosmetic imperfections.
This item is being sold as a used industrial X-ray inspection system. The photos are of the actual item being sold.
We will do our best to answer questions and provide additional photos, videos, or information upon request.
Inspections at our facility are welcomed and encouraged.
- Please contact SMT Sales Group for additional information or to make an offer
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Contact SMT Sales Group using the form below or email lcoole@mac.com for additional information or inquiries.
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