Manncorp MC301 Benchtop Reflow Oven

Manufacturer: Manncorp
Model # MC301
DOM:  2016
Reference No.: 529L

Information:

Manncorp MC301 Four-Zone Benchtop Reflow Oven

Lead-Free SMT Reflow System

Manncorp MC301 Benchtop Reflow Oven, a compact, high-performance SMT reflow solution designed for prototype, low-volume, R&D, laboratory, and production environments. The MC301 combines advanced thermal profiling, multi-zone temperature control, and intuitive touchscreen operation into a space-saving platform ideal for modern electronics manufacturing.

Featuring four independently controlled heating zones, integrated cooling, programmable lead-free profiles, and closed-loop temperature control, the MC301 delivers highly repeatable soldering performance for SMT assemblies requiring precise thermal management.

This unit powers up and operates as shown and includes the original Manncorp documentation.

Key Features

• Four independently controlled heating zones
• Advanced touchscreen operator interface
• Lead-free and tin-lead solder profile capability
• Programmable thermal profiles
• Closed-loop temperature feedback control
• Forced convection heating system
• Integrated cooling zone
• Real-time profile graphing and monitoring
• Compact benchtop footprint
• Suitable for prototype through low-volume production
• Excellent for PCB assembly, electronics manufacturing, engineering labs, and product development environments

Applications

The Manncorp MC301 is ideal for:

• SMT PCB assembly
• Electronics manufacturing
• Contract manufacturing (EMS)
• Prototype production
• Product development laboratories
• Engineering and research facilities
• Aerospace electronics
• Medical electronics
• Military and defense electronics
• Industrial controls manufacturing
• University engineering programs
• Process development and thermal profiling

Advanced Thermal Control

The MC301 utilizes a sophisticated four-zone heating architecture designed to accurately manage the critical stages of the reflow process:

Zone 1 – Preheat

Controlled ramp-up to prevent thermal shock and component stress.

Zone 2 – Soak

Stabilizes assembly temperatures and activates solder flux.

Zone 3 – Reflow

Achieves solder liquidus temperatures for reliable interconnect formation.

Zone 4 – Cooling

Controlled cooling minimizes thermal stress and promotes consistent solder joint quality.

The touchscreen interface allows operators to create, save, modify, and recall process recipes for a wide variety of PCB designs and solder paste formulations.

User-Friendly Touchscreen Interface

The integrated color touchscreen provides:

• Real-time process monitoring
• Profile editing
• Temperature graphing
• Recipe storage
• Zone control adjustments
• Process diagnostics
• Lead-free profile management

Operators can quickly switch between stored production profiles, improving setup efficiency and repeatability.

Typical Specifications

Manufacturer: Manncorp

Model: MC301

Type: Benchtop Reflow Oven

Heating Zones: 4 Independent Zones

Heating Technology: Forced Convection

Control System: Touchscreen PLC Interface

Profile Storage: Multiple Saved Profiles

Solder Types:

• Lead-Free
• SnPb

Cooling: Integrated Cooling Zone

Temperature Monitoring: Closed-Loop Feedback

Power: Standard Industrial Electrical Service

Application: SMT Reflow Soldering

PCB Processing: Prototype through Low-Volume Production

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Contact SMT Sales Group using the form below or email lcoole@mac.com for additional information or inquiries.

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